Physical, Mathematical, Computer and Life Sciences Information Technology and Computer Sciences

Rework and Repair of Electronic Assemblies Training

SAQA US 259166 | NQF 5 | Credits 15 | Duration 12 Days
From $2,214 per delegate

Description

This course equips learners with the skills to rework and repair electronic assemblies to industry standards. It covers the identification of defects, selection of appropriate tools and techniques, and the application of safe soldering and desoldering practices. By the end, participants will be able to restore electronic assemblies to functional and reliable condition.

Learning Outcomes

  • Identify and classify common defects in electronic assemblies using visual inspection and testing equipment.
  • Apply correct desoldering and soldering techniques to remove and replace through-hole and surface-mount components without damaging the board.
  • Select and use appropriate tools, materials, and safety equipment for rework and repair tasks.
  • Demonstrate adherence to electrostatic discharge (ESD) prevention and workplace safety procedures during rework operations.
  • Evaluate the quality of rework and repair work against IPC or equivalent industry standards.
  • Document repair actions and outcomes in accordance with company quality procedures.

Target Audience

This course is designed for electronics technicians, assembly workers, and maintenance personnel who are responsible for repairing and reworking printed circuit boards and electronic assemblies in a manufacturing or service environment.

Prerequisites

None — open enrollment.

Course Outline

Day 1: Introduction to Rework and Repair Standards

Objectives:
• Understand the scope and importance of rework and repair in electronic assemblies
• Identify relevant SAQA unit standards and industry specifications
• Recognize safety and ESD precautions
• Explain the role of documentation and traceability

Topics:
• Overview of rework vs repair vs modification
• Applicable standards: IPC-7711/7721, SAQA 259166
• ESD control and safe work practices
• Documentation: work orders, repair logs, quality records
• Introduction to tools and equipment
• Material identification: solder alloys, fluxes, conformal coatings

Day 2: Soldering Fundamentals and Inspection

Objectives:
• Demonstrate proper soldering iron setup and maintenance
• Identify good and defective solder joints
• Apply visual inspection criteria per IPC-A-610
• Perform basic through-hole soldering and desoldering

Topics:
• Solder iron types, tips, temperature settings
• Flux and solder wire selection
• Through-hole soldering techniques
• Desoldering methods: wick, vacuum pump, hot air
• Solder joint defects: cold joints, bridges, insufficient wetting
• Inspection criteria for through-hole and surface mount

Day 3: Surface Mount Technology (SMT) Basics

Objectives:
• Understand SMT component types and packages
• Demonstrate manual placement and soldering of SMT components
• Use rework stations for SMT removal and replacement
• Inspect SMT joints under magnification

Topics:
• SMT package types: chip, SOIC, QFP, BGA
• Manual pick and place techniques
• Hot air rework station operation
• Solder paste application and reflow
• Inspection using microscope and X-ray (principles)
• Common SMT defects: tombstoning, skewing, opens

Day 4: Through-Hole Rework and Repair

Objectives:
• Perform removal and replacement of through-hole components
• Repair damaged plated through-holes (PTH)
• Install and remove connectors and heavy components
• Apply thermal management techniques

Topics:
• Desoldering large multi-pin components
• PTH repair using eyelets and conductive epoxy
• Connector replacement methods
• Heat sinks and thermal relief
• Replacing switches, potentiometers, transformers
• Post-repair inspection and testing

Day 5: Conformal Coating and Underfill

Objectives:
• Identify types of conformal coatings and their applications
• Apply and remove conformal coatings
• Perform underfill rework on BGA and CSP components
• Inspect coating integrity

Topics:
• Conformal coating types: acrylic, urethane, silicone, parylene
• Application methods: brush, spray, dip
• Coating removal: chemical, mechanical, laser
• Underfill materials and dispensing
• Curing processes
• Inspection for bubbles, delamination, thickness

Day 6: BGA and Fine Pitch Rework

Objectives:
• Understand BGA rework processes
• Remove and replace BGA components using rework stations
• Apply solder paste and flux correctly
• Inspect BGA joints using X-ray and dye penetration

Topics:
• BGA rework equipment: preheaters, top heaters, profiling
• Solder ball attachment and reballing
• Flux application and cleaning
• Alignment and placement techniques
• X-ray inspection principles
• Dye penetration testing for cracks

Day 7: Conductor Repair and Lifting

Objectives:
• Repair lifted pads and damaged traces
• Perform conductor bridging and jumper wire installation
• Understand laminate repair techniques
• Apply conductive epoxy and UV cure materials

Topics:
• Pad repair using epoxy and copper foil
• Trace repair with conductive ink or wire
• Jumper wire routing and strain relief
• Laminate repair for delamination
• Conductive adhesive selection and curing
• Insulation and coating after repair

Day 8: Component Damage and Replacement Strategies

Objectives:
• Identify damaged components and assess repairability
• Replace damaged ICs, connectors, and passive components
• Handle moisture-sensitive devices (MSD)
• Apply proper cleaning techniques post-repair

Topics:
• Damage assessment criteria
• IC removal and replacement techniques
• Connector pin replacement
• MSD handling and baking
• Cleaning solvents and methods: ultrasonic, spray, manual
• Residue inspection and cleanliness testing

Day 9: Advanced Rework for Hybrid and High-Reliability Assemblies

Objectives:
• Apply rework techniques to hybrid circuits and RF assemblies
• Understand thermal management for sensitive components
• Perform rework on flex circuits and rigid-flex boards
• Maintain hermeticity and sealing

Topics:
• Hybrid circuit rework: wire bonding, die attachment
• RF component handling: impedance control
• Flex circuit repair: reinforcement, adhesive bonding
• Rigid-flex separation repair
• Hermetic sealing and leak testing
• High-reliability soldering: controlled atmospheres

Day 10: Quality Control and Process Validation

Objectives:
• Develop rework and repair procedures
• Perform process validation and first article inspection
• Understand statistical process control (SPC) basics
• Conduct failure analysis and root cause investigation

Topics:
• Procedure writing and work instructions
• First article inspection checklist
• SPC for rework processes: defect tracking
• Failure analysis techniques: microscopy, cross-sectioning
• Root cause analysis tools: fishbone, 5 whys
• Corrective and preventive actions (CAPA)

Day 11: Health, Safety, and Environmental Compliance

Objectives:
• Apply health and safety regulations in rework areas
• Handle hazardous materials correctly
• Implement waste management and recycling
• Understand RoHS, REACH, and other regulations

Topics:
• OHS Act and relevant regulations
• Material Safety Data Sheets (MSDS)
• Ventilation and fume extraction
• Lead-free soldering compliance
• Waste disposal: solder dross, chemicals, packaging
• Environmental management systems

Day 12: Final Assessment and Practical Integration

Objectives:
• Complete a comprehensive rework and repair project
• Demonstrate all skills learned in the course
• Pass written and practical assessments
• Receive feedback and certification guidance

Topics:
• Integrated repair project: multiple defects on test board
• Written examination covering standards, theory, and safety
• Practical assessment: BGA rework, trace repair, coating removal
• Review of common mistakes and troubleshooting
• Certification process and continuing education
• Course evaluation and feedback

Practicals

48 hours of practicals To be conducted online or on-campus or in-house
Overview

Hands-on practicals form the core of this course, allowing learners to apply rework and repair techniques on actual electronic assemblies. Under supervision, learners practice soldering, desoldering, component replacement, conformal coating, and inspection, building proficiency and confidence.

Practical Activities
  • Soldering and Desoldering Fundamentals — Learners practice through-hole and SMT soldering and desoldering on training boards, including use of soldering iron, hot air station, and desoldering tools. (8h)
  • SMT and BGA Rework — Learners remove and replace SMT components and BGA packages using rework stations, including solder paste application, reflow profiling, and X-ray inspection. (12h)
  • Conformal Coating and Underfill Application — Learners apply and remove conformal coatings using brush and spray methods, and perform underfill rework on BGA components. (8h)
  • Conductor Repair and Lifted Pad Repair — Learners repair lifted pads, damaged traces, and laminate delamination using conductive epoxy, jumper wires, and reinforcement techniques. (8h)
  • Integrated Repair Project and Assessment — Learners perform a comprehensive repair on a test board with multiple defects, including component replacement, trace repair, and coating removal, followed by inspection and testing. (12h)

Summatives

Each delegate is assessed continuously throughout the course via daily exercises, scored practical assignments, and a final summative test at the end.

Practical Assignments — 30%

Practical assignments are observed and scored against a rubric during the practical sessions. Each delegate's practical mark is averaged into a single 100% score and contributes 30% to the final total.

Daily Exercises — 20%

Every training day ends with a multiple-choice exercise scored out of 100%. The scores from each daily exercise are averaged across the duration of the course to produce a Daily Average mark, which contributes 20% to the final total.

Final Test — 50%

On the last day a final summative test is written. It is a multiple-choice paper with multiple-answer questions: each question may have more than one correct option, and a single wrong selection on a question marks the entire question wrong — no partial credit. The final test is scored out of 100% and contributes 50% to the overall mark.

Final Total
Component Out of Weight
Practical Assignments (rubric-scored) 100% 30%
Daily Average (multiple choice) 100% 20%
Final Test (multi-answer multiple choice) 100% 50%
Final Total 100%

All marks are recorded on the AATICD LMS and visible to each learner under their account.

Certificate

Certificate of Completion

Awarded to delegates who achieve an overall mark of 50% or higher on the Final Total (Practicals 30% + Daily Average 20% + Final Test 50%).

How it works
  • Certificates are auto-generated on the AATICD LMS as soon as the marks pass the 50% threshold.
  • Each certificate is a branded PDF with the delegate's name, the course title, the unit standard ID, NQF level, credits, and the date of issue.
  • You can download or print your certificate from your LMS dashboard at any time after issue — there's no reissue fee and no expiry date.
  • If you scored under 50% you can sit the final test again at the next scheduled session at no extra cost.
Where to find it

Sign in to the LMS, open your dashboard, and your certificates appear under My Certificates. Each entry has a View / Download button and a print option.

Training Discounts

Group discounts apply automatically — the more delegates you enrol, the greater the saving. Discounts are calculated at 3% per 5 delegates, scaling up to 40% off for 100+ delegates.

Delegates Discount
5 3% off
10 6% off
15 9% off
20 12% off
25 15% off
30 18% off
50 30% off
75 35% off
100 40% off

3% discount per 5 delegates, up to 40% off for 100+ delegates. Contact us for a custom group quote.

Upcoming Training Sessions
Online training — attend live sessions from anywhere via our virtual classroom.
No online sessions scheduled yet.
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On-Campus training — face-to-face sessions at our training venues across Africa and beyond.
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Let us know you're interested and we'll arrange a session that suits you.
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In-House training — we bring the trainer to your organisation, tailored to your team.
No in-house sessions scheduled yet.
Let us know you're interested and we'll arrange a session that suits you.
Contact Us
Training Discounts
Delegates Discount
5 3% off
10 6% off
15 9% off
20 12% off
25 15% off
30 18% off
50 30% off
75 35% off
100 40% off

3% off per 5 delegates, up to 40% for 100+

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