Physical, Mathematical, Computer and Life Sciences › Information Technology and Computer Sciences
This course equips learners with the skills to rework and repair electronic assemblies to industry standards. It covers the identification of defects, selection of appropriate tools and techniques, and the application of safe soldering and desoldering practices. By the end, participants will be able to restore electronic assemblies to functional and reliable condition.
This course is designed for electronics technicians, assembly workers, and maintenance personnel who are responsible for repairing and reworking printed circuit boards and electronic assemblies in a manufacturing or service environment.
None — open enrollment.
Objectives:
• Understand the scope and importance of rework and repair in electronic assemblies
• Identify relevant SAQA unit standards and industry specifications
• Recognize safety and ESD precautions
• Explain the role of documentation and traceability
Topics:
• Overview of rework vs repair vs modification
• Applicable standards: IPC-7711/7721, SAQA 259166
• ESD control and safe work practices
• Documentation: work orders, repair logs, quality records
• Introduction to tools and equipment
• Material identification: solder alloys, fluxes, conformal coatings
Objectives:
• Demonstrate proper soldering iron setup and maintenance
• Identify good and defective solder joints
• Apply visual inspection criteria per IPC-A-610
• Perform basic through-hole soldering and desoldering
Topics:
• Solder iron types, tips, temperature settings
• Flux and solder wire selection
• Through-hole soldering techniques
• Desoldering methods: wick, vacuum pump, hot air
• Solder joint defects: cold joints, bridges, insufficient wetting
• Inspection criteria for through-hole and surface mount
Objectives:
• Understand SMT component types and packages
• Demonstrate manual placement and soldering of SMT components
• Use rework stations for SMT removal and replacement
• Inspect SMT joints under magnification
Topics:
• SMT package types: chip, SOIC, QFP, BGA
• Manual pick and place techniques
• Hot air rework station operation
• Solder paste application and reflow
• Inspection using microscope and X-ray (principles)
• Common SMT defects: tombstoning, skewing, opens
Objectives:
• Perform removal and replacement of through-hole components
• Repair damaged plated through-holes (PTH)
• Install and remove connectors and heavy components
• Apply thermal management techniques
Topics:
• Desoldering large multi-pin components
• PTH repair using eyelets and conductive epoxy
• Connector replacement methods
• Heat sinks and thermal relief
• Replacing switches, potentiometers, transformers
• Post-repair inspection and testing
Objectives:
• Identify types of conformal coatings and their applications
• Apply and remove conformal coatings
• Perform underfill rework on BGA and CSP components
• Inspect coating integrity
Topics:
• Conformal coating types: acrylic, urethane, silicone, parylene
• Application methods: brush, spray, dip
• Coating removal: chemical, mechanical, laser
• Underfill materials and dispensing
• Curing processes
• Inspection for bubbles, delamination, thickness
Objectives:
• Understand BGA rework processes
• Remove and replace BGA components using rework stations
• Apply solder paste and flux correctly
• Inspect BGA joints using X-ray and dye penetration
Topics:
• BGA rework equipment: preheaters, top heaters, profiling
• Solder ball attachment and reballing
• Flux application and cleaning
• Alignment and placement techniques
• X-ray inspection principles
• Dye penetration testing for cracks
Objectives:
• Repair lifted pads and damaged traces
• Perform conductor bridging and jumper wire installation
• Understand laminate repair techniques
• Apply conductive epoxy and UV cure materials
Topics:
• Pad repair using epoxy and copper foil
• Trace repair with conductive ink or wire
• Jumper wire routing and strain relief
• Laminate repair for delamination
• Conductive adhesive selection and curing
• Insulation and coating after repair
Objectives:
• Identify damaged components and assess repairability
• Replace damaged ICs, connectors, and passive components
• Handle moisture-sensitive devices (MSD)
• Apply proper cleaning techniques post-repair
Topics:
• Damage assessment criteria
• IC removal and replacement techniques
• Connector pin replacement
• MSD handling and baking
• Cleaning solvents and methods: ultrasonic, spray, manual
• Residue inspection and cleanliness testing
Objectives:
• Apply rework techniques to hybrid circuits and RF assemblies
• Understand thermal management for sensitive components
• Perform rework on flex circuits and rigid-flex boards
• Maintain hermeticity and sealing
Topics:
• Hybrid circuit rework: wire bonding, die attachment
• RF component handling: impedance control
• Flex circuit repair: reinforcement, adhesive bonding
• Rigid-flex separation repair
• Hermetic sealing and leak testing
• High-reliability soldering: controlled atmospheres
Objectives:
• Develop rework and repair procedures
• Perform process validation and first article inspection
• Understand statistical process control (SPC) basics
• Conduct failure analysis and root cause investigation
Topics:
• Procedure writing and work instructions
• First article inspection checklist
• SPC for rework processes: defect tracking
• Failure analysis techniques: microscopy, cross-sectioning
• Root cause analysis tools: fishbone, 5 whys
• Corrective and preventive actions (CAPA)
Objectives:
• Apply health and safety regulations in rework areas
• Handle hazardous materials correctly
• Implement waste management and recycling
• Understand RoHS, REACH, and other regulations
Topics:
• OHS Act and relevant regulations
• Material Safety Data Sheets (MSDS)
• Ventilation and fume extraction
• Lead-free soldering compliance
• Waste disposal: solder dross, chemicals, packaging
• Environmental management systems
Objectives:
• Complete a comprehensive rework and repair project
• Demonstrate all skills learned in the course
• Pass written and practical assessments
• Receive feedback and certification guidance
Topics:
• Integrated repair project: multiple defects on test board
• Written examination covering standards, theory, and safety
• Practical assessment: BGA rework, trace repair, coating removal
• Review of common mistakes and troubleshooting
• Certification process and continuing education
• Course evaluation and feedback
Hands-on practicals form the core of this course, allowing learners to apply rework and repair techniques on actual electronic assemblies. Under supervision, learners practice soldering, desoldering, component replacement, conformal coating, and inspection, building proficiency and confidence.
Each delegate is assessed continuously throughout the course via daily exercises, scored practical assignments, and a final summative test at the end.
Practical assignments are observed and scored against a rubric during the practical sessions. Each delegate's practical mark is averaged into a single 100% score and contributes 30% to the final total.
Every training day ends with a multiple-choice exercise scored out of 100%. The scores from each daily exercise are averaged across the duration of the course to produce a Daily Average mark, which contributes 20% to the final total.
On the last day a final summative test is written. It is a multiple-choice paper with multiple-answer questions: each question may have more than one correct option, and a single wrong selection on a question marks the entire question wrong — no partial credit. The final test is scored out of 100% and contributes 50% to the overall mark.
| Component | Out of | Weight |
|---|---|---|
| Practical Assignments (rubric-scored) | 100% | 30% |
| Daily Average (multiple choice) | 100% | 20% |
| Final Test (multi-answer multiple choice) | 100% | 50% |
| Final Total | — | 100% |
All marks are recorded on the AATICD LMS and visible to each learner under their account.
Sign in to the LMS, open your dashboard, and your certificates appear under My Certificates. Each entry has a View / Download button and a print option.
Group discounts apply automatically — the more delegates you enrol, the greater the saving. Discounts are calculated at 3% per 5 delegates, scaling up to 40% off for 100+ delegates.
| Delegates | Discount |
|---|---|
| 5 | 3% off |
| 10 | 6% off |
| 15 | 9% off |
| 20 | 12% off |
| 25 | 15% off |
| 30 | 18% off |
| 50 | 30% off |
| 75 | 35% off |
| 100 | 40% off |
3% discount per 5 delegates, up to 40% off for 100+ delegates. Contact us for a custom group quote.
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